Cooling

V8 Ace 3DHP

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Overview The EngineeringBehind One As Two. Cooling performance doesn’t always require a second tower. It comes from understanding how heat moves. The V8 ACE 3DHP combines patented 3D Heat Pipe technology (3DHP), SCCHP heat pipes, and dual 30 mm fans into a thermal system engineered to maximize cooling performance in a single-tower design. Hybrid Heatpipe Core 2× 3DHP + 4× SCCHP heat pipes move and spread heat more efficiently. Pressure-Tuned Airflow Dual 120 × 30 mm fans maintain airflow through dense fin stacks. Dedicated Models Separate AMD and Intel designs optimize cooling for each platform. Validated Performance Ranked the #1 single-tower AMD air cooler by independent lab Cybenetics. R&D Follow theThermal Path. Every part of the V8 ACE 3DHP is designed around one goal: managing heat more effectively. Follow the path from heat pickup to heat dissipation to see how each component contributes to One As Two. 01 / Heat Pickup 3DHP Heat Path The third branch reaches the CPU hotspot, capturing heat a standard U-shaped heat pipe can miss. 02 / Heat Distribution Hybrid Heatpipes Two 3DHP and four SCCHP heat pipes spread heat across more of the fin stack. 03 / Heat Dissipation Dense Fin Stack A larger effective cooling surface gives moving air more heat to carry away. 04 / Intake Airflow Front Pressure Fan A 120 × 30 mm fan pushes cool air deep into the dense fin stack. 05 / Exhaust Airflow Rear Exhaust Fan A second 120 × 30 mm fan pulls heated air completely through the heatsink. 06 / Blade Stability LCP Blades Liquid crystal polymer blades resist flex, helping maintain stable airflow at higher speeds. 07 / Platform Optimization Platform-Tuned Mounting The base geometry and heatpipe tuning are optimized separately for Intel and AMD processors. 08 / Easy Installation Sliding Side Fans Slide the fan clips instead of removing them, supporting memory modules up to 45 mm tall. 09 / V8 Design Engine-Inspired Top A bold industrial design inspired by the mechanical character of a V8 engine. Proof Independent Validation #1 Single-TowerAMD Air Cooler The V8 ACE 3DHP AMD leads every single-tower air cooler in the Cybenetics database. Independent Result:#1 single-tower AMD air cooler and #2 air cooler overall in the tested Cybenetics data set. Cybenetics-Tested Performance Cybenetics Tested.Engineered to CompeteWith Bigger Coolers. Independent testing ranked the V8 ACE 3DHP AMD second overall among every air cooler tested, including larger dual-tower designs. 1Leading Single-Tower Performance Highest-ranked single-tower AMD air cooler in the tested Cybenetics database. 2Overall Air Cooling Second overall among every air cooler tested, including larger dual-tower designs. Full-Speed Testing Evaluated under controlled full-speed testing to measure maximum cooling performance. Independent Lab Results verified by Cybenetics, an independent hardware testing and certification laboratory. Test Note: Based on Cybenetics AMD full-speed test data. Results may vary by system configuration and test conditions. 3DHP Six Pipes.One System. Two patented 3DHP heatpipes capture heat at the CPU hotspot. Four SCCHP heatpipes distribute it across the fin stack. Together, they create a unified thermal system. CPU hotspot → hybrid pipe network → fin stack → airflow Each stage is tuned to keep heat moving away from the processor instead of building up in one part of the cooler. Higher Fin Utilization Put More of theFin Stackto Work. Traditional heatpipe layouts concentrate heat in a smaller area of the heatsink. The hybrid 3DHP architecture spreads heat farther across the fin stack, allowing more of the cooler to participate in heat dissipation. More Than 95% Fin Utilization Up from roughly 70% in a conventional layout, based on Cooler Master internal testing. Reduced Thermal Blind Spots Heat is distributed more evenly across the fin stack instead of remaining concentrated near the center. Sustained Cooling Performance More active cooling surface helps maintain performance during extended workloads. Airflow AirflowTwo Fans.Two Roles. The front and rear fans are engineered for different airflow roles. One builds pressure to push cool air through the heatsink. The other efficiently pulls heated air away. Together, they maximize cooling performance while helping reduce unwanted noise. Front Fan Standard Blades Up to 2500 RPM to build pressure through the dense fin stack. Rear Fan Reverse Ring Blades Up to 2050 RPM to pull heated air through the cooler while maintaining a clean visible face. Offset Fan Speeds 2500 RPM/2050 RPM Different operating speeds help reduce harmonic noise between the two fans. LCP Blade Stability Less Flex.More Airflow. Liquid Crystal Polymer provides twice the structural strength needed to resist blade deformation and vibration at higher speeds. That stability maintains tighter tip clearance, reducing air leakage and supporting stronger static pressure. 2× Structural Strength LCP blades resist flex and vibration at high fan speeds. Tighter Tip Clearance Less blade flex reduces air leakage at the blade tips. Loop Dynamic Bearings Designed for smooth operation and long-term durability. Platform Platform-TunedCooling.Two Platforms.Two Thermal Designs. Intel and AMD processors don’t generate or transfer heat the same way. Separate V8 ACE 3DHP models tailor the base geometry, heatpipe design, and thermal capacity to the platform they are built to cool. Intel Convex Base Matches the bowed surface common to Intel desktop processors for more complete contact. AMD Flat Base Matches the flatter AM4 and AM5 heat spreader for more even contact. Platform-Tuned 3DHP Each heatpipe network is optimized for the thermal characteristics of its platform. Technical Note: Intel and AMD versions use different 3DHP designs. The Intel model targets a 90 W Q-Max, while the AMD model targets 70 W. Q-Max measures the heat transfer capacity of the heatpipe, not the processor’s power consumption. Compact Footprint Max Performance.Min Footprint. The V8 ACE 3DHP delivers the cooling performance of much larger air coolers in a compact single-tower design. That leaves more room around the CPU socket for memory, motherboard components, and future upgrades without sacrificing thermal headroom. 45 mm RAM Clearance Sliding side fans provide clearance for memory modules up to 45 mm tall without removing the fan clips. Single-Tower Access The compact heatsink leaves more space around the CPU socket, making building, upgrades, and maintenance easier. Compact Compatibility Delivers high-end cooling in a single-tower design that fits a wider range of systems than larger dual-tower coolers. Acoustic Control Fan ControlImproves Acoustics. Two fans running at the same speed can reinforce the same frequencies and create unwanted resonance. The V8 ACE 3DHP offsets front and rear fan speeds to reduce harmonic resonance while maintaining strong airflow. 2500 RPM Front Fan Higher speed builds the static pressure needed to push air through the fin stack. 2050 RPM Rear Fan Lower speed efficiently removes heated air from the cooler. Purposeful Speed Offset Different maximum speeds help reduce harmonic resonance between the fans. Specs One Architecture.Two Platforms. The Intel and AMD models share the same cooling architecture, fan system, and overall design. Platform-specific base geometry, 3DHP heatpipe design, and thermal capacity are optimized for how each processor transfers heat. Product Page: V8 ACE 3DHP Technical Specifications Specification Details Product Cooler Master V8 ACE 3DHP AMD Socket Support AM5 / AM4 Intel Socket Support LGA 1851 / 1700 / 1200 / 1151 / 1150 / 1155 / 1156 Dimensions 138.95 × 136.47 × 167.3 mm Heatsink 2 × 3DHP + 4 × SCCHP + Aluminum Fins Front Fan Size 120 × 120 × 30 mm Front Fan Speed 0–2500 ±250 RPM Front Fan Airflow 89.6 CFM Front Fan Pressure 3.85 mmH₂O Front Fan Noise 37 dB(A) Rear Fan Size 120 × 120 × 30 mm Rear Fan Speed 0–2050 ±250 RPM Rear Fan Airflow 61.0 CFM Rear Fan Pressure 2.0 mmH₂O Rear Fan Noise 34 dB(A) Fan Bearing Loop Dynamic Bearing RAM Clearance Up to 45 mm Warranty 6 Years