V8 Ace 3DHP

Description

Overview

The Engineering
Behind One As Two.

Cooling performance doesn’t always require a second tower.

It comes from understanding how heat moves.

The V8 ACE 3DHP combines patented 3D Heat Pipe technology (3DHP), SCCHP heat pipes, and dual 30 mm fans into a thermal system engineered to maximize cooling performance in a single-tower design.

Hybrid Heatpipe Core

2× 3DHP + 4× SCCHP heat pipes move and spread heat more efficiently.

Pressure-Tuned Airflow

Dual 120 × 30 mm fans maintain airflow through dense fin stacks.

Dedicated Models

Separate AMD and Intel designs optimize cooling for each platform.

Validated Performance

Ranked the #1 single-tower AMD air cooler by independent lab Cybenetics.

V8 ACE 3DHP installed in a gaming PC

R&D

Follow the
Thermal Path.

Every part of the V8 ACE 3DHP is designed around one goal: managing heat more effectively. Follow the path from heat pickup to heat dissipation to see how each component contributes to One As Two.

Thermal path diagram of V8 ACE 3DHP with numbered callouts

01 / Heat Pickup

3DHP Heat Path

The third branch reaches the CPU hotspot, capturing heat a standard U-shaped heat pipe can miss.

02 / Heat Distribution

Hybrid Heatpipes

Two 3DHP and four SCCHP heat pipes spread heat across more of the fin stack.

03 / Heat Dissipation

Dense Fin Stack

A larger effective cooling surface gives moving air more heat to carry away.

04 / Intake Airflow

Front Pressure Fan

A 120 × 30 mm fan pushes cool air deep into the dense fin stack.

05 / Exhaust Airflow

Rear Exhaust Fan

A second 120 × 30 mm fan pulls heated air completely through the heatsink.

06 / Blade Stability

LCP Blades

Liquid crystal polymer blades resist flex, helping maintain stable airflow at higher speeds.

07 / Platform Optimization

Platform-Tuned Mounting

The base geometry and heatpipe tuning are optimized separately for Intel and AMD processors.

08 / Easy Installation

Sliding Side Fans

Slide the fan clips instead of removing them, supporting memory modules up to 45 mm tall.

09 / V8 Design

Engine-Inspired Top

A bold industrial design inspired by the mechanical character of a V8 engine.

Proof

Cybenetics-Tested Performance

Cybenetics Tested.
Engineered to Compete
With Bigger Coolers.

Independent testing ranked the V8 ACE 3DHP AMD second overall among every air cooler tested, including larger dual-tower designs.

1Leading Single-Tower Performance

Highest-ranked single-tower AMD air cooler in the tested Cybenetics database.

2Overall Air Cooling

Second overall among every air cooler tested, including larger dual-tower designs.

Full-Speed Testing

Evaluated under controlled full-speed testing to measure maximum cooling performance.

CybeneticsIndependent Lab

Results verified by Cybenetics, an independent hardware testing and certification laboratory.

Test Note: Based on Cybenetics AMD full-speed test data. Results may vary by system configuration and test conditions.

3DHP

3DHP heatpipe path visualization

Six Pipes.
One System.

Two patented 3DHP heatpipes capture heat at the CPU hotspot. Four SCCHP heatpipes distribute it across the fin stack. Together, they create a unified thermal system.

CPU hotspot → hybrid pipe network → fin stack → airflow

Each stage is tuned to keep heat moving away from the processor instead of building up in one part of the cooler.


Hybrid heatpipe architecture diagram
Fin utilization thermal comparison

Higher Fin Utilization

Put More of the
Fin Stack
to Work.

Traditional heatpipe layouts concentrate heat in a smaller area of the heatsink. The hybrid 3DHP architecture spreads heat farther across the fin stack, allowing more of the cooler to participate in heat dissipation.

More Than 95% Fin Utilization

Up from roughly 70% in a conventional layout, based on Cooler Master internal testing.

Reduced Thermal Blind Spots

Heat is distributed more evenly across the fin stack instead of remaining concentrated near the center.

Sustained Cooling Performance

More active cooling surface helps maintain performance during extended workloads.

Airflow

Airflow
Two Fans.
Two Roles.

The front and rear fans are engineered for different airflow roles. One builds pressure to push cool air through the heatsink. The other efficiently pulls heated air away. Together, they maximize cooling performance while helping reduce unwanted noise.

Front Fan Standard Blades

Up to 2500 RPM to build pressure through the dense fin stack.

Rear Fan Reverse Ring Blades

Up to 2050 RPM to pull heated air through the cooler while maintaining a clean visible face.

Offset Fan Speeds 2500 RPM/2050 RPM

Different operating speeds help reduce harmonic noise between the two fans.

Exploded dual-fan airflow configuration

LCP Blade Stability

Less Flex.
More Airflow.

Liquid Crystal Polymer provides twice the structural strength needed to resist blade deformation and vibration at higher speeds. That stability maintains tighter tip clearance, reducing air leakage and supporting stronger static pressure.

2× Structural Strength

LCP blades resist flex and vibration at high fan speeds.

Tighter Tip Clearance

Less blade flex reduces air leakage at the blade tips.

Loop Dynamic Bearings

Designed for smooth operation and long-term durability.

Platform

Platform-Tuned
Cooling.
Two Platforms.
Two Thermal Designs.

Intel and AMD processors don’t generate or transfer heat the same way. Separate V8 ACE 3DHP models tailor the base geometry, heatpipe design, and thermal capacity to the platform they are built to cool.

Intel Convex Base

Matches the bowed surface common to Intel desktop processors for more complete contact.

AMD Flat Base

Matches the flatter AM4 and AM5 heat spreader for more even contact.

Platform-Tuned 3DHP

Each heatpipe network is optimized for the thermal characteristics of its platform.

Technical Note: Intel and AMD versions use different 3DHP designs. The Intel model targets a 90 W Q-Max, while the AMD model targets 70 W. Q-Max measures the heat transfer capacity of the heatpipe, not the processor’s power consumption.
Intel and AMD platform-tuned V8 ACE 3DHP models
V8 ACE 3DHP dimensions and footprint diagrams

Compact Footprint

Max Performance.
Min Footprint.

The V8 ACE 3DHP delivers the cooling performance of much larger air coolers in a compact single-tower design. That leaves more room around the CPU socket for memory, motherboard components, and future upgrades without sacrificing thermal headroom.

45 mm RAM Clearance

Sliding side fans provide clearance for memory modules up to 45 mm tall without removing the fan clips.

Single-Tower Access

The compact heatsink leaves more space around the CPU socket, making building, upgrades, and maintenance easier.

Compact Compatibility

Delivers high-end cooling in a single-tower design that fits a wider range of systems than larger dual-tower coolers.

Acoustic Control

Fan Control
Improves Acoustics.

Two fans running at the same speed can reinforce the same frequencies and create unwanted resonance. The V8 ACE 3DHP offsets front and rear fan speeds to reduce harmonic resonance while maintaining strong airflow.

2500 RPM Front Fan

Higher speed builds the static pressure needed to push air through the fin stack.

2050 RPM Rear Fan

Lower speed efficiently removes heated air from the cooler.

Purposeful Speed Offset

Different maximum speeds help reduce harmonic resonance between the fans.

PC build with V8 ACE 3DHP and acoustic visualization

Specs

One Architecture.
Two Platforms.

The Intel and AMD models share the same cooling architecture, fan system, and overall design. Platform-specific base geometry, 3DHP heatpipe design, and thermal capacity are optimized for how each processor transfers heat.

Product Page: V8 ACE 3DHP

Technical Specifications

Specification Details
Product Cooler Master V8 ACE 3DHP
AMD Socket Support AM5 / AM4
Intel Socket Support LGA 1851 / 1700 / 1200 / 1151 / 1150 / 1155 / 1156
Dimensions 138.95 × 136.47 × 167.3 mm
Heatsink 2 × 3DHP + 4 × SCCHP + Aluminum Fins
Front Fan Size 120 × 120 × 30 mm
Front Fan Speed 0–2500 ±250 RPM
Front Fan Airflow 89.6 CFM
Front Fan Pressure 3.85 mmH₂O
Front Fan Noise 37 dB(A)
Rear Fan Size 120 × 120 × 30 mm
Rear Fan Speed 0–2050 ±250 RPM
Rear Fan Airflow 61.0 CFM
Rear Fan Pressure 2.0 mmH₂O
Rear Fan Noise 34 dB(A)
Fan Bearing Loop Dynamic Bearing
RAM Clearance Up to 45 mm
Warranty 6 Years


V8 Ace 3DHP

Product form

Overview The EngineeringBehind One As Two. Cooling performance doesn’t always require a second tower. It comes from understanding how heat... Read more

€109.90 Incl. VAT

SKU: MAM-T6HA-225PK-RB
Barcode: 4719512169483

    • Shipped today? Order within: Oct 21, 2026 23:59:00 +0200

      Description

      Overview

      The Engineering
      Behind One As Two.

      Cooling performance doesn’t always require a second tower.

      It comes from understanding how heat moves.

      The V8 ACE 3DHP combines patented 3D Heat Pipe technology (3DHP), SCCHP heat pipes, and dual 30 mm fans into a thermal system engineered to maximize cooling performance in a single-tower design.

      Hybrid Heatpipe Core

      2× 3DHP + 4× SCCHP heat pipes move and spread heat more efficiently.

      Pressure-Tuned Airflow

      Dual 120 × 30 mm fans maintain airflow through dense fin stacks.

      Dedicated Models

      Separate AMD and Intel designs optimize cooling for each platform.

      Validated Performance

      Ranked the #1 single-tower AMD air cooler by independent lab Cybenetics.

      V8 ACE 3DHP installed in a gaming PC

      R&D

      Follow the
      Thermal Path.

      Every part of the V8 ACE 3DHP is designed around one goal: managing heat more effectively. Follow the path from heat pickup to heat dissipation to see how each component contributes to One As Two.

      Thermal path diagram of V8 ACE 3DHP with numbered callouts

      01 / Heat Pickup

      3DHP Heat Path

      The third branch reaches the CPU hotspot, capturing heat a standard U-shaped heat pipe can miss.

      02 / Heat Distribution

      Hybrid Heatpipes

      Two 3DHP and four SCCHP heat pipes spread heat across more of the fin stack.

      03 / Heat Dissipation

      Dense Fin Stack

      A larger effective cooling surface gives moving air more heat to carry away.

      04 / Intake Airflow

      Front Pressure Fan

      A 120 × 30 mm fan pushes cool air deep into the dense fin stack.

      05 / Exhaust Airflow

      Rear Exhaust Fan

      A second 120 × 30 mm fan pulls heated air completely through the heatsink.

      06 / Blade Stability

      LCP Blades

      Liquid crystal polymer blades resist flex, helping maintain stable airflow at higher speeds.

      07 / Platform Optimization

      Platform-Tuned Mounting

      The base geometry and heatpipe tuning are optimized separately for Intel and AMD processors.

      08 / Easy Installation

      Sliding Side Fans

      Slide the fan clips instead of removing them, supporting memory modules up to 45 mm tall.

      09 / V8 Design

      Engine-Inspired Top

      A bold industrial design inspired by the mechanical character of a V8 engine.

      Proof

      Cybenetics-Tested Performance

      Cybenetics Tested.
      Engineered to Compete
      With Bigger Coolers.

      Independent testing ranked the V8 ACE 3DHP AMD second overall among every air cooler tested, including larger dual-tower designs.

      1Leading Single-Tower Performance

      Highest-ranked single-tower AMD air cooler in the tested Cybenetics database.

      2Overall Air Cooling

      Second overall among every air cooler tested, including larger dual-tower designs.

      Full-Speed Testing

      Evaluated under controlled full-speed testing to measure maximum cooling performance.

      CybeneticsIndependent Lab

      Results verified by Cybenetics, an independent hardware testing and certification laboratory.

      Test Note: Based on Cybenetics AMD full-speed test data. Results may vary by system configuration and test conditions.

      3DHP

      3DHP heatpipe path visualization

      Six Pipes.
      One System.

      Two patented 3DHP heatpipes capture heat at the CPU hotspot. Four SCCHP heatpipes distribute it across the fin stack. Together, they create a unified thermal system.

      CPU hotspot → hybrid pipe network → fin stack → airflow

      Each stage is tuned to keep heat moving away from the processor instead of building up in one part of the cooler.


      Hybrid heatpipe architecture diagram
      Fin utilization thermal comparison

      Higher Fin Utilization

      Put More of the
      Fin Stack
      to Work.

      Traditional heatpipe layouts concentrate heat in a smaller area of the heatsink. The hybrid 3DHP architecture spreads heat farther across the fin stack, allowing more of the cooler to participate in heat dissipation.

      More Than 95% Fin Utilization

      Up from roughly 70% in a conventional layout, based on Cooler Master internal testing.

      Reduced Thermal Blind Spots

      Heat is distributed more evenly across the fin stack instead of remaining concentrated near the center.

      Sustained Cooling Performance

      More active cooling surface helps maintain performance during extended workloads.

      Airflow

      Airflow
      Two Fans.
      Two Roles.

      The front and rear fans are engineered for different airflow roles. One builds pressure to push cool air through the heatsink. The other efficiently pulls heated air away. Together, they maximize cooling performance while helping reduce unwanted noise.

      Front Fan Standard Blades

      Up to 2500 RPM to build pressure through the dense fin stack.

      Rear Fan Reverse Ring Blades

      Up to 2050 RPM to pull heated air through the cooler while maintaining a clean visible face.

      Offset Fan Speeds 2500 RPM/2050 RPM

      Different operating speeds help reduce harmonic noise between the two fans.

      Exploded dual-fan airflow configuration

      LCP Blade Stability

      Less Flex.
      More Airflow.

      Liquid Crystal Polymer provides twice the structural strength needed to resist blade deformation and vibration at higher speeds. That stability maintains tighter tip clearance, reducing air leakage and supporting stronger static pressure.

      2× Structural Strength

      LCP blades resist flex and vibration at high fan speeds.

      Tighter Tip Clearance

      Less blade flex reduces air leakage at the blade tips.

      Loop Dynamic Bearings

      Designed for smooth operation and long-term durability.

      Platform

      Platform-Tuned
      Cooling.
      Two Platforms.
      Two Thermal Designs.

      Intel and AMD processors don’t generate or transfer heat the same way. Separate V8 ACE 3DHP models tailor the base geometry, heatpipe design, and thermal capacity to the platform they are built to cool.

      Intel Convex Base

      Matches the bowed surface common to Intel desktop processors for more complete contact.

      AMD Flat Base

      Matches the flatter AM4 and AM5 heat spreader for more even contact.

      Platform-Tuned 3DHP

      Each heatpipe network is optimized for the thermal characteristics of its platform.

      Technical Note: Intel and AMD versions use different 3DHP designs. The Intel model targets a 90 W Q-Max, while the AMD model targets 70 W. Q-Max measures the heat transfer capacity of the heatpipe, not the processor’s power consumption.
      Intel and AMD platform-tuned V8 ACE 3DHP models
      V8 ACE 3DHP dimensions and footprint diagrams

      Compact Footprint

      Max Performance.
      Min Footprint.

      The V8 ACE 3DHP delivers the cooling performance of much larger air coolers in a compact single-tower design. That leaves more room around the CPU socket for memory, motherboard components, and future upgrades without sacrificing thermal headroom.

      45 mm RAM Clearance

      Sliding side fans provide clearance for memory modules up to 45 mm tall without removing the fan clips.

      Single-Tower Access

      The compact heatsink leaves more space around the CPU socket, making building, upgrades, and maintenance easier.

      Compact Compatibility

      Delivers high-end cooling in a single-tower design that fits a wider range of systems than larger dual-tower coolers.

      Acoustic Control

      Fan Control
      Improves Acoustics.

      Two fans running at the same speed can reinforce the same frequencies and create unwanted resonance. The V8 ACE 3DHP offsets front and rear fan speeds to reduce harmonic resonance while maintaining strong airflow.

      2500 RPM Front Fan

      Higher speed builds the static pressure needed to push air through the fin stack.

      2050 RPM Rear Fan

      Lower speed efficiently removes heated air from the cooler.

      Purposeful Speed Offset

      Different maximum speeds help reduce harmonic resonance between the fans.

      PC build with V8 ACE 3DHP and acoustic visualization

      Specs

      One Architecture.
      Two Platforms.

      The Intel and AMD models share the same cooling architecture, fan system, and overall design. Platform-specific base geometry, 3DHP heatpipe design, and thermal capacity are optimized for how each processor transfers heat.

      Product Page: V8 ACE 3DHP

      Technical Specifications

      Specification Details
      Product Cooler Master V8 ACE 3DHP
      AMD Socket Support AM5 / AM4
      Intel Socket Support LGA 1851 / 1700 / 1200 / 1151 / 1150 / 1155 / 1156
      Dimensions 138.95 × 136.47 × 167.3 mm
      Heatsink 2 × 3DHP + 4 × SCCHP + Aluminum Fins
      Front Fan Size 120 × 120 × 30 mm
      Front Fan Speed 0–2500 ±250 RPM
      Front Fan Airflow 89.6 CFM
      Front Fan Pressure 3.85 mmH₂O
      Front Fan Noise 37 dB(A)
      Rear Fan Size 120 × 120 × 30 mm
      Rear Fan Speed 0–2050 ±250 RPM
      Rear Fan Airflow 61.0 CFM
      Rear Fan Pressure 2.0 mmH₂O
      Rear Fan Noise 34 dB(A)
      Fan Bearing Loop Dynamic Bearing
      RAM Clearance Up to 45 mm
      Warranty 6 Years


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